Copyright © Fuji Chemical(Suzhou) Trading Co., Ltd. 苏ICP备10204714号 By300.cn
This product is one component adhesive for electronic chips and modules with preservation stability.
It cures in one to two minutes at temperatures of 90°C to 150°C required for SMD mounting.
It is adaptable for fine application regardless of high-speed dispenser or printing.
Fine Application
This material has been widely adopted for 0402 inch size of chip capacitor and resistor.
It has been also used for 0603 inch size of chip capacitor and resistor, and the number of inquiries is increasing.
Fast Curing
All products can cure within 60–90 seconds.
Fine Application
This material has been widely adopted for 0402 inch size of chip capacitor and resistor.
It has been also used for 0603 inch size of chip capacitor and resistor, and the number of inquiries is increasing.
Fast Curing
All products can cure within 60–90 seconds.
Specifications
This product has excellent heat resistance and exhibits high adhesive strength in various applications.
Its stable shape makes it easy to control the application range.
High Heat-resistant Adhesiveness
This product has excellent heat resistance and maintains high adhesiveness.
Stable Application Shape
The thixotropy keeps the application shape with an appropriate raise height.
| Item | NE7300H | NE7200H | NE7250H | NE3300H | NE3000S | NE8800K | NE8800T |
|---|---|---|---|---|---|---|---|
| Applying method |
High-speed dispenser Screen printing Thick mask |
Screen printing Thick mask | High-speed dispenser | ||||
| Specific gravity | 1.35 | 1.25 | 1.44 | 1.23 | 1.38 | 1.3 | 1.33 |
| Viscosity(Pa・s) 25℃ |
320 | 300 | 330 | 310 | 390 | 300 | 310 |
| Thixotropy index | 7.1 | 7 | 5 | 6.1 | 5 | 6.8 | 6.3 |
| Glass transition (℃)DSC |
43 | 116 | 118 | 122 | 131 | 84 | 87 |
| Curing condition | 100℃/60 sec 90℃/90 sec |
140℃/60 sec 120℃/90 sec |
120℃/60 sec 110℃/120 sec |
140℃/60 sec 130℃/90 sec |
150℃/60 sec 130℃/90 sec |
150℃/60 sec 140℃/90 sec |
150℃/60 sec 130℃/90 sec |
| Shelf life ＠2~10℃ |
8 mths. | 9 mths. | 7 mths. | 9 mths. | 6 mths. | 6 mths. | 6 mths. |
NE9000H is a one-component high-temperature curing epoxy adhesive for
double-sided reflow and suppresses falling, misalignment, and floating of component.
It does not inhibit the self-alignment phenomenon of solder paste and realizes high-precision mounting.
High-precision Mounting (±50 µm)
This is a material that can be used for high-precision mounting of ±50 µm required for LED headlights, and prevents the misalignment of LED chips.
Simultaneous reflow curing
Allows solder paste self-alignment at reflow.
This material cures under the SAC reflow condition and starts curing at a temperature close to the solder melting temperature.
Therefore, it does not inhibit the self-alignment property of solder.
High-precision Mounting (±50 µm)
This is a material that can be used for high-precision mounting of ±50 µm required for LED headlights, and prevents the misalignment of LED chips.
Simultaneous reflow curing
Allows solder paste self-alignment at reflow.
This material cures under the SAC reflow condition and starts curing at a temperature close to the solder melting temperature.
Therefore, it does not inhibit the self-alignment property of solder.
Specifications
Suppresses falling, shifting, or floating during double-sided reflow.
Application in a raised shape with height is possible, and the application stability is excellent.
Improved Mounting Accuracy
Suppresses falling, misalignment,
and the floating of component during double-sided reflow, enabling high-precision mounting.
Stable Application Shape
Good adhesion due to maintenance of a raised shape with height during application by a dispenser.
| Item | NE9000H |
|---|---|
| Usefulness | Adhesive for reflow curing |
| Appearance | Red liquid |
| Specific gravity | 1.23 |
| Viscosity(Pa・s)25℃ | 320Pa・s |
| Thixotropy index | 7.0 |
| Curing condition | SAC reflow（220℃/30sec or more） |
| Storage condition | 2〜10℃ |
| Shelf life ＠2~10℃ |
9 mths. |
This is a one-component heat curing epoxy adhesive that meets the needs
for low-temperature and short-time curing.
It is best suitable fixing LED backlight lenses, assembling VCM actuators,
and adhering resins (ABS, acrylic, etc.) with a heat resistance of 100°C or less.
The LTG800 is also suitable for joining resins, sealing, and adhering glasses.
60℃ curing
Sufficient adhesive strength can be obtained even at a low temperature of 60°C.
It can be used not only for fixing LED lenses and VCM actuators but also for adhering and sealing applications to substrates with heat resistance problems and sealing applications.
Bleed less
In customer evaluation, it was confirmed that occurrence of bleeding can be suppressed by 75% or more compared to conventional products.
60℃ curing
Sufficient adhesive strength can be obtained even at a low temperature of 60°C.
It can be used not only for fixing LED lenses and VCM actuators but also for adhering and sealing applications to substrates with heat resistance problems and sealing applications.
Bleed less
In customer evaluation, it was confirmed that occurrence of bleeding can be suppressed by 75% or more compared to conventional products.
Specifications
Cures at low temperature and in a short time,
and exhibits sufficient adhesiveness and heat resistance after curing.
Application in a raised shape with height is possible and the application stability is excellent.
Stable Application Shape
Even with a dispenser, there is no dripping or stringing, and a stable application shape is maintained.
Production Cost Reduction
Low temperature curing allows production cost reductions during heating.
No Blending or
Weighing Required
Weighing or blending of the main agent and curing agent is not required, and stable quality can be always obtained.
| Item | LTG830 | LTG800 | LTG800W |
|---|---|---|---|
| Usefulness | For VCM actuators | For LED backlight | For LED backlight |
| Appearance | Clear liquid | Black liquid | White liquid |
| Specific gravity | 1.20 | 1.48 | 1.49 |
| Viscosity(Pa・s) 25℃ | 3.8 | 100 | 80 |
| Thixotropy index | 1.0 | 6.0 | 7.1 |
| Curing condition | 60℃/60min. | 60℃/30min. 80℃/3min. |
60℃/30min. 80℃/3min. |
| Storage condition | -20℃ | -20℃ | -20℃ |
| Shelf life | 4 mths. | 6 mths. | 6 mths. |
This product permeates without gaps to reinforce solder joints.
It can be reused by heating and contributes to cost reductions as well.
High Permeability
The low-viscosity grades permeate easily and quickly between BGA or CSP and the substrate.
Excellent Repairability
Excellent repairability allows reuse of expensive IC chips and electronic substrates without discarding them.
High Permeability
The low-viscosity grades permeate easily and quickly between BGA or CSP and the substrate.
Excellent Repairability
Excellent repairability allows reuse of expensive IC chips and electronic substrates without discarding them.
Specifications
Effective measures can be implemented against external stresses of heat and impact,
which are the weak points of IC chips that are becoming smaller and more integrated.
Easy Application due to Permeation
When filled between the part and substrate, this product can be quickly permeated and applied by capillarity.
Cost Reduction by Reuse
Since this product can be removed after softening by heating, expensive parts and substrates can be reused.
| Item | UF317H | UF330H | UF346HW | FJ-1201※ | FJ-1185※ | FJ-1100※ | FJ-1186※ | |
|---|---|---|---|---|---|---|---|---|
| Feature | Can be repaired Good permeability |
Can be repaired Refrigerated Item |
Can be repaired Low Tg |
Refrigerated Item High Tg |
High permeability High Tg |
Can be repaired High Tg |
Fine filler High Tg |
|
| Appearance | Black liquid | White liquid | Black liquid | |||||
| Viscosity(mPa・s) 23℃ | 1,600 | 3,300 | 1,400 | 3,000 | 800 | 400 | 11,000 | |
| Curing condition | 120℃/10min. | 120℃/10min. | 120℃/5min. | 120℃/10min. | 150℃/30min. | 130℃/8min. | 150℃/60min. | |
| Filler Filler diameter(μm) Avg/Max |
Not included | Included 2/10 | ||||||
| Shelf life | ≦10℃ 8 mths. |
≦10℃ 8 mths. |
≦10℃ 8 mths. |
≦5℃ 6 mths. |
≦-20℃ 6 mths. |
≦-20℃ 6 mths. |
≦-20℃ 6 mths. |
|
| Tg | TMA | 53℃ | 72℃ | 19℃ | 95℃ | 160℃ | 121℃ | 117℃ |
| DMA | 91℃ | 104℃ | 61℃ | 122℃ | 164℃ | 143℃ | 138℃ | |
| CTE | >Tg | 41ppm | 89ppm | 55ppm | 72ppm | 66ppm | 56ppm | 32ppm |
| <Tg | 187ppm | 214ppm | 194ppm | 186ppm | 170ppm | 176ppm | 103ppm | |
| Tensile elasticity | 25℃ | 3.1GPa | 1.3GPa | 3.2GPa | 2.5GPa | 2.9GPa | 2.7GPa | 8.9GPa |
| 200℃ | 37MPa | 36MPa | 23MPa | 46MPa | 100MPa | 20MPa | 400MPa | |
This is a cleaning agent dedicated for epoxy-based chip adhesives and is suitable for cleaning of dispenser nozzles and printing plates.
A safe water-soluble solvent that is friendly to the environment and the human body is used, and the agent exhibits high detergency.
High Detergency
Epoxy adhesives do not dissolve in conventional solvents, such as alcohol-based solvents, and have a problem with difficulty in cleaning.
However, RED Cleaner is a cleaning agent dedicated for epoxy adhesives and exhibits a high cleaning ability for dispenser nozzles and printing masks (metal and plastic).
Non-Hazardous material
Since RED Cleaner is a water-based solvent, it is nonflammable and highly safe, does not use air pollutants or ozone-depleting substances, and is a product that is also considerate of the natural environment.
High Detergency
Epoxy adhesives do not dissolve in conventional solvents, such as alcohol-based solvents, and have a problem with difficulty in cleaning.
However, RED Cleaner is a cleaning agent dedicated for epoxy adhesives and exhibits a high cleaning ability for dispenser nozzles and printing masks (metal and plastic).
Non-Hazardous material
Since RED Cleaner is a water-based solvent, it is nonflammable and highly safe, does not use air pollutants or ozone-depleting substances, and is a product that is also considerate of the natural environment.
Specifications
This product offers high solubility in epoxy resins with excellent detergency.
Since it is a water-soluble solvent that is friendly to the environment and workers, it is nonflammable and improves safety.
Uses Water-soluble Solvent
A water-soluble solvent that dissolves epoxy resin efficiently is adopted.
Friendly to
Environment and Human Body
Since this product does not use VOC compounds or carcinogens to reduce hazards to workers, it can be used safely.
| Item | Characteristic value |
|---|---|
| Water content(wt%) | 30～35 |
| Appearance | Transparent |
| Density(g/mL ，～22℃) | 1.06 |
| pH | 5.6 |
| Odor | Sweet |
| Shelf life | 1 Year |
| Packaging form | Plastic bottle for 1KG Plastic container for 20KG |
PRODUCT